From: Packaging News
Amsterdam (The Netherlands) will host the seventh edition of the ISTA European Packaging Symposium from March 5-7, 2019.
It’s the main European forum on packaging for distribution and is organised jointly by ISTA (International Safe Transit Association), ITENE (Research Centre of Packaging, Transport and Logistics) and NVC (Netherlands Packaging Centre).
On this occasion, the symposium will analyse the impact of industry 4.0 in this sector. Under the title “Industry 4.0: Packaging Innovation and Impacts in a Changing World”, information will be provided on the changes that may affect transportation packaging due to the deep transformations that are taking place in the market, driven by the advances in automation, cyber-physical systems, artificial intelligence, the Internet of things (IoT), 3D printing and rising concerns for sustainability.
Alongside this, the different presentations will also offer a practical overview of the economic and environmental aspects of optimising the development of packaging for transport, and the latest techniques for testing packaged products to assess the suitability for its distribution.
These presentations will be offered by representatives from Amazon, IKEA, IBM, HP, Intel Corporation, Sealed Air, Smurfit Kappa, Safe Load, ISTA, ITENE, NVC, Fraunhofer Institut IML and Metropack among others. All of them have confirmed their participation at this event, which is sponsored by Smurfit Kappa.
The symposium, which will take place at the Marriott Hotel in the Dutch capital, aims to bring together around 100 professionals, including directors, managers and technicians of logistics, packaging, production, purchasing, R&D, product design and development of companies in the packaging, transport, logistics and storage sectors, large distribution, consumer goods, electronics, capital goods, testing laboratories and test equipment, among others.
Based in the United States, ISTA is a leader in the development of laboratory protocols and standards designed to define the behaviour of the packaging in such a way that it ensures optimum protection of the products during the distribution process. ISTA, whose origins go back to the year 1948, counts nowadays with testing processes and certification programs in the field of transport packaging recognised worldwide.
For its part, ITENE, at the head of the Board of ISTA Europe, brings its international experience in packaging engineering and transport simulation aimed at solving problems and optimising packaging systems in order to meet the needs of the market in terms of cost savings, regulatory compliance, cargo protection and circular economy requirements.
In its facilities in the Technological Park of Paterna, in Valencia, ITENE has a Transportation Simulation Centre that counts with the most advanced equipment to analyse the behaviour of packaging in normal and extreme conditions, whether the transport is made by land or sea.
NVC, founded in 1953, is an association of companies dedicated to packaging and involved throughout the supply chain. NVC encourages the continuous improvement of packaging solutions through its members, projects, information services and training programs.